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CY25100
Document #: 38-07499 Rev. *D
Page 10 of 11
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
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Package Diagrams (continued)
8
PIN1ID
SEATING
PLANE
1
BSC.
BSC
0°-8°
PLANE
GAUGE
2.90[0.114]
1.10[0.043] MAX.
0.65[0.025]
0.20[0.008]
0.05[0.002]
6.50[0.256]
0.076[0.003]
6.25[0.246]
4.50[0.177]
4.30[0.169]
3.10[0.122]
0.15[0.006]
0.19[0.007]
0.30[0.012]
0.09[[0.003]
0.25[0.010]
0.70[0.027]
0.50[0.020]
0.95[0.037]
0.85[0.033]
DIMENSIONS IN MM[INCHES] MIN.
MAX.
8-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z8
51-85093-*A