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5962-9466902Q9B Datasheet(PDF) 4 Page - Texas Instruments |
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5962-9466902Q9B Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 15 page  TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATINGPOINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024C − MARCH 1997 − REVISED OCTOBER 2001 4 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 SMJ 320 C 40 M KGD 50 PREFIX SMJ = MIL-PRF-38535 Processing TMP = Commercial Level DEVICE FAMILY 320 = DSP Family TECHNOLOGY C = CMOS DEVICE 40 = Floating-Point DSP SPEED RANGE 40 = 40 MHz 50 = 50 MHz PACKAGE TYPE KGD = Known Good Die TEMPERATURE RANGE M (Military) = −55 °C to 125°C L (Commercial) = 0 °Cto 70°C C DIE REVISION C = Revision 5.2 T KGD OPTION T = TWB process blank = R-Tab process Figure 1. TMP / SMJ320C40KGD Device Nomenclature JEDEC STANDARD D Die thickness is approximately 15 mils ± 1 mil. D Backside surface finish is silicon. D Maximum allowable die junction operating temperature is 175°C. D Glassivation material is compressive nitride. D Bond pad metal is composed of copper-doped aluminum. D Percent defective allowed for burned-in die is 5. D Life test data is available. D Configuration control notification. D Group A attribute summary is available (SMJ only). D Suggested die-attach material is silver glass (QMI 2569F). D Suggested bond wire size is 1.25 mil. D For gold bumped KGD die, suggested bonding method is gold-ball bonding. D ESD rating is Class II. D Maximum allowable peak process temperature for die-attach is 440°C ± 5°C (for QMS2569F) D Saw kerf is dependent on blade size used. D Die backside potential is left floating. |
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