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SMJ320MCM42DHFNL40 Datasheet(PDF) 1 Page - Texas Instruments

Part # SMJ320MCM42DHFNL40
Description  DUAL SMJ320C40 MULTICHIP MODULE
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SMJ320MCM42DHFNL40 Datasheet(HTML) 1 Page - Texas Instruments

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SMJ320MCM42C, SMJ320MCM42D
DUAL SMJ320C40 MULTICHIP MODULE
SGKS001D -- JULY 1997 -- REVISED OCTOBER 2001
1
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251--1443
D
Performance:
-- 80 Million Floating-Point Operations Per
Second (MFLOPS) With 496-MBps-Burst
I/O Rate for 40-MHz Modules
-- Zero-Wait-State Local Memory for Each
Processor
D
Organization:
-- 128K-Word × 32-Bit Static
Random-Access Memory (SRAM)
(SMJ320MCM42D)
-- 256K-Word × 32-Bit SRAM
(SMJ320MCM42C)
D
Compliant With MIL-PRF-38535 QML
D
Dual C40 Performance With Local Memory
Requiring Only 8.7 Square Inches of Board
Space
D
Enhanced Performance Offered By
Multichip-Module Solution
-- SMJ320MCM42C
-- 67% Reduction in Number of
Interconnects
-- 54% Reduction (Minimum) in Board
Area
-- Estimated 38% Reduction in Power
Dissipation Due to Reduced Parasitic
Capacitance and Interconnect Lengths
-- SMJ320MCM42D
-- 56% Reduction in Number of
Interconnects
-- 30% Reduction (Minimum) in Board
Area
-- Estimated 20% Reduction in Power
Dissipation Due to Reduced Parasitic
Capacitance and Interconnect Lengths
D
Four Memory Ports for High Data
Bandwidth
-- Two Full 2G-Word External Buses
D
Two Internal Buses Mapped to Memory
-- 128K-Word × 32-Bit SRAM for Each C40
Local Bus (SMJ320MCM42D)
-- 256K-Word × 32-Bit SRAM for Each C40
Local Bus (SMJ320MCM42C)
D
Ten External Communication Ports for
Direct Processor-to-Processor
Communication
D
IEEE-1149.1(JTAG) Boundary-Scan
Compatible
D
408-Lead Ceramic Quad Flatpack Package
(HFN Suffix)
D
Operating Free-Air Temperature Ranges:
--55°C to 125°C...(Military)
0°Cto70°C...(Commercial)
D
Communication-Port Connection Provided
Between C40s for Interprocessor
Communication
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Terminal assignment information is provided by the terminal
assignments table. Package is shown for pinout reference only.
HFN PACKAGE
(TOP VIEW)
306
1
102
205
408
307
103
204
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2001, Texas Instruments Incorporated
IEEE Standard 1149.1--1990 Standard Test-Access Port and Boundary-Scan Architecture
On products compliant to MIL-STD-PRF-38535, all parameters
are tested unless otherwise noted. On all other products,
production processingdoes notnecessarily include testing ofall
parameters.


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