Page 6

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Document ID

Issued Date

Revised Date

Revision

Page.

Profile Feature

Soldering Condition

Average ramp-up rate(T to T )

<3

/sec

Preheat

-Temperature Min(Tsmin)

150

-Temperature Max(Tsmax)

200

-Time(min to max)(t )

60~120sec

Tsmax to T

-Ramp-upRate

<3

/sec

Time maintained above:

-Temperature(T )

217

-Time(t )

60~260sec

Peak Temperature(T )

255

0/ 5

Time within 5

of actual Peak

Temperature(t )

Ramp-down Rate

<6

/sec

Time 25

to Peak Temperature

<6minutes

LP

s

L

L

L

P

P

o

o

o

o

o

oo

o

o

o

C

C

C

C

C

C-

+

C

C

C

C

3.Reflow soldering

10~30sec

1.Storage environment: Temperature=5

~40

Humidity=55% 25%

2.Reflow soldering of surface-mount devices

±

oo

CC

Suggested thermal profiles for soldering processes

Critical Zone

TL to TP

Critical Zone

TL to TP

TL

Tsmax

Tsmin

Ramp-up

Tp

tS

Preheat

t25 C to Peak

o

Time

25

TL

TP

Ramp-down

Reel packing

Reel packing

SMA-S

2,000

4.0

20,000

183*155*183

178

382*356*392

160,000

15.5

PACKAGE

REEL SIZE

REEL

COMPONENT

SPACING

BOX

INNER

BOX

REEL

DIA,

CARTON

SIZE

CARTON

APPROX.

GROSS WEIGHT

(kg)

(pcs)

(m/m)

(m/m)

(m/m)

(pcs)

(m/m)

(pcs)

7"

13"

7,500

4.0

15,000

337*337*37

330

350*330*360

120,000

14.2

Formosa MS

FEGFM105-S

DS-121540

2013/04/30

-

A

7

Chip Fast Efficient Rectifiers