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TPS54010MPWPEP Datasheet(PDF) 10 Page - Texas Instruments |
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TPS54010MPWPEP Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 31 page  Connect Pin 1 to Analog Ground Plane in This Area for Optimum Performance Minimum Recommended Top Side Analog Ground Area 0.3478 0.0150 0.06 0.0256 0.1700 0.1340 0.0630 0.0400 Ø 0.0180 4 PL 0.2090 Ø 0.0130 8 PL Minimum Recommended Exposed Copper Area for PowerPAD. 5mm Stencils May Require 10 Percent Larger Area 0.0650 0.0500 0.0500 0.0650 0.0339 0.0339 0.0500 Minimum Recommended Thermal Vias: 8 x 0.013 Diameter Inside PowerPAD Area 4 x 0.018 Diameter Under Device as Shown. Additional 0.018 Diameter Vias May Be Used if Top Side Analog Ground Area Is Extended. 0.3820 TPS54010-EP SLVSBN3 – JANUARY 2013 www.ti.com close, but maintain as much separation as possible heat, and any area available must be used when 6-A while keeping the layout compact. Connect the bias or greater operation is desired. Connection from the capacitor from the VBIAS pin to analog ground using exposed area of the PowerPAD to the analog ground the isolated analog ground trace. If a slow-start plane layer must be made using 0.013-inch diameter capacitor or RT resistor is used, or if the SYNC pin is vias to avoid solder wicking through the vias. used to select 350-kHz operating frequency, connect Eight vias must be in the PowerPAD area with four them to this trace. additional vias located under the device package. The For operation at full rated load current, the analog size of the vias under the package, but not in the ground plane must provide an adequate heat- exposed thermal pad area, can be increased to dissipating area. A 3-inch by 3-inch plane of 1-ounce 0.018. Additional vias beyond the twelve copper is recommended, though not mandatory, recommended that enhance thermal performance depending on ambient temperature and airflow. Most must be included in areas not under the device applications have larger areas of internal ground package. plane available, and the PowerPAD must be connected to the largest area available. Additional areas on the top or bottom layers also help dissipate Figure 11. Recommended Land Pattern for 28-Pin PWP PowerPAD 10 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPS54010-EP |
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