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OPA682N Datasheet(PDF) 6 Page - Texas Instruments

Part # OPA682N
Description  Wideband, Fixed Gain BUFFER AMPLIFIER
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA682N Datasheet(HTML) 6 Page - Texas Instruments

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6
®
OPA682
ABSOLUTE MAXIMUM RATINGS
Power Supply ..............................................................................
±6.5VDC
Internal Power Dissipation(1) ............................ See Thermal Information
Differential Input Voltage ..................................................................
±1.2V
Input Voltage Range ............................................................................
±V
S
Storage Temperature Range: P, U, N ........................... –40
°C to +125°C
Lead Temperature (soldering, 10s) .............................................. +300
°C
Junction Temperature (TJ ) ........................................................... +175°C
NOTE:: (1) Packages must be derated based on specified
θ
JA. Maximum TJ
must be observed.
PACKAGE
DRAWING
TEMPERATURE
PACKAGE
ORDERING
TRANSPORT
PRODUCT
PACKAGE
NUMBER(1)
RANGE
MARKING
NUMBER(2)
MEDIA
OPA682P
8-Pin Plastic DIP
006
–40
°C to +85°C
OPA682P
OPA682P
Rails
OPA682U
SO-8 Surface Mount
182
–40
°C to +85°C
OPA682U
OPA682U
Rails
"
""""
OPA682U/2K5
Tape and Reel
OPA682N
6-Lead SOT23
332
–40
°C to +85°C
A82
OPA682N/250
Tape and Reel
""
"
"
OPA682N/3K
Tape and Reel
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet. (2) Models with a slash (/) are available only in Tape and Reel in the quantities
indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “OPA682U/2K5” will get a single 2500-piece Tape and Reel.
PACKAGE/ORDERING INFORMATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
Electrostatic discharge can cause damage ranging from perfor-
mance degradation to complete device failure. Burr-Brown Corpo-
ration recommends that all integrated circuits be handled and stored
using appropriate ESD protection methods.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes
could cause the device not to meet published specifications.
PIN CONFIGURATION
Top View
DIP/SO-8
1
2
3
6
5
4
Output
–V
S
+IN
+V
S
DIS
–IN
R
F
400
R
G
400
12
3
65
4
A82
Pin Orientation/Package Marking
1
2
3
4
8
7
6
5
DIS
+V
S
Output
NC
RF
400
RG
400
NC
–IN
+IN
–V
S
NC: No Connection
Top View
SOT23-6


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