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OPA698IDR Datasheet(PDF) 2 Page - Texas Instruments |
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OPA698IDR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 27 page OPA698 2 SBOS258B www.ti.com SINGLES DUALS DESCRIPTION Output Limiting OPA699 High Gain BW, Non-unity Gain Stable Voltage Feedback OPA690 OPA2690 High Slew, Unity Gain Stable SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR(1) RANGE MARKING NUMBER MEDIA, QUANTITY OPA698 SO-8 Surface Mount D –40 °C to +85°C OPA698ID OPA698ID Rails, 100 "" " " " OPA698IDR Tape and Reel, 2500 ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage ............................................................................. ±6.5V DC Internal Power Dissipation .......................... See Thermal Characteristics Common-Mode Input Voltage ............................................................. ±V S Differential Input Voltage ..................................................................... ±V S Limiter Voltage Range ........................................................... ±(V S – 0.7V) Storage Temperature Range: ID .................................... –40 °C to +125°C Lead Temperature (SO-8, soldering, 3s) ...................................... +260 °C ESD Resistance: HBM .................................................................... 2000V MM ........................................................................ 200V CDM .................................................................... 1000V NOTE: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. PIN CONFIGURATION Top View SO 1 2 3 4 NC = Not Connected 8 7 6 5 NC Inverting Input Noninverting Input –V S V H +V S Output V L ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com. RELATED PRODUCTS |
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