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TPS3106K33DBVT Datasheet(PDF) 5 Page - Texas Instruments |
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TPS3106K33DBVT Datasheet(HTML) 5 Page - Texas Instruments |
5 / 31 page TPS3103, TPS3106, TPS3110 www.ti.com SLVS363F – AUGUST 2001 – REVISED NOVEMBER 2015 7.4 Thermal Information TPS31xx THERMAL METRIC(1) DBV (SOT-23) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 183.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 123.3 °C/W RθJB Junction-to-board thermal resistance 29.4 °C/W ψJT Junction-to-top characterization parameter 20.5 °C/W ψJB Junction-to-board characterization parameter 29 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2001–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS3103 TPS3106 TPS3110 |
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