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OPA354, OPA2354, OPA4354

www.ti.com

SBOS233F – MARCH 2002 – REVISED JUNE 2016

Product Folder Links: OPA354 OPA2354 OPA4354

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Copyright © 2002–2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information: OPA354

OPA354

UNIT

DBV (SOT-23)

DDA (HSOP)

5 PINS

8 PINS

Junction-to-ambient thermal resistance

216.3

42.5

°C/W

Junction-to-case (top) thermal resistance

84.3

54

°C/W

Junction-to-board thermal resistance

43.1

26.5

°C/W

Junction-to-top characterization parameter

3.8

8

°C/W

Junction-to-board characterization parameter

42.3

26.4

°C/W

Junction-to-case (bottom) thermal resistance

—

3.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: OPA2354

OPA2354

UNIT

DDA (HSOP)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

40.6

175.9

°C/W

Junction-to-case (top) thermal resistance

46

67.8

°C/W

Junction-to-board thermal resistance

20.7

97.1

°C/W

Junction-to-top characterization parameter

5.6

9.3

°C/W

Junction-to-board characterization parameter

20.6

95.5

°C/W

Junction-to-case (bottom) thermal resistance

2.5

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.6 Thermal Information: OPA4354

OPA4354

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

83.8

92.6

°C/W

Junction-to-case (top) thermal resistance

70.7

27.5

°C/W

Junction-to-board thermal resistance

59.5

33.6

°C/W

Junction-to-top characterization parameter

11.6

1.9

°C/W

Junction-to-board characterization parameter

37.7

33.1

°C/W

Junction-to-case (bottom) thermal resistance

—

—

°C/W