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OPA2354 Datasheet(PDF) 7 Page - Texas Instruments |
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OPA2354 Datasheet(HTML) 7 Page - Texas Instruments |
7 / 44 page 7 OPA354, OPA2354, OPA4354 www.ti.com SBOS233F – MARCH 2002 – REVISED JUNE 2016 Product Folder Links: OPA354 OPA2354 OPA4354 Submit Documentation Feedback Copyright © 2002–2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information: OPA354 THERMAL METRIC(1) OPA354 UNIT DBV (SOT-23) DDA (HSOP) 5 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 216.3 42.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 84.3 54 °C/W RθJB Junction-to-board thermal resistance 43.1 26.5 °C/W ψJT Junction-to-top characterization parameter 3.8 8 °C/W ψJB Junction-to-board characterization parameter 42.3 26.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — 3.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Thermal Information: OPA2354 THERMAL METRIC(1) OPA2354 UNIT DDA (HSOP) DGK (VSSOP) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 40.6 175.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 46 67.8 °C/W RθJB Junction-to-board thermal resistance 20.7 97.1 °C/W ψJT Junction-to-top characterization parameter 5.6 9.3 °C/W ψJB Junction-to-board characterization parameter 20.6 95.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.5 — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.6 Thermal Information: OPA4354 THERMAL METRIC(1) OPA4354 UNIT D (SOIC) PW (TSSOP) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 83.8 92.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 70.7 27.5 °C/W RθJB Junction-to-board thermal resistance 59.5 33.6 °C/W ψJT Junction-to-top characterization parameter 11.6 1.9 °C/W ψJB Junction-to-board characterization parameter 37.7 33.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W |
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