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ISO7841, ISO7841F

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SLLSEM3F – NOVEMBER 2014 – REVISED APRIL 2016

Product Folder Links: ISO7841 ISO7841F

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

ISO7841

UNIT

DW (SOIC)

DWW (SOIC)

16 Pins

16 Pins

Junction-to-ambient thermal resistance

78.9

78.9

°C/W

Junction-to-case(top) thermal resistance

41.6

41.1

°C/W

Junction-to-board thermal resistance

43.6

49.5

°C/W

Junction-to-top characterization parameter

15.5

15.2

°C/W

Junction-to-board characterization parameter

43.1

48.8

°C/W

N/A

N/A

°C/W

6.5 Power Dissipation Characteristics

VALUE

UNIT

Maximum power dissipation by ISO78410x

square wave

200

mW

Maximum power dissipation by side-1 of

ISO78410x

50

Maximum power dissipation by side-2 of

ISO78410x

150