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OPA2541SM Datasheet(PDF) 5 Page - Texas Instruments |
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OPA2541SM Datasheet(HTML) 5 Page - Texas Instruments |
5 / 13 page ® OPA2541 5 Z LOAD = ∞, VS = ±35V, AV = +1 DYNAMIC RESPONSE TYPICAL PERFORMANCE CURVES (CONT) TA = +25°C and VS = ±35VDC, unless otherwise noted. pation (total of both amplifiers) times the appropriate ther- mal resistance— ∆ T JC = (PD total) (θJC). Sufficient heat sinking must be provided to keep the case temperature within safe limits for the maximum ambient temperature and power dissipation. The thermal resistance of the heat sink required may be calculated by: θ HS = (150°C – ∆ TJC – TA)/PD. Commercially available heat sinks usually specify thermal resistance. These ratings are often suspect, however, since they depend greatly on the mounting environment and air flow conditions. Actual thermal performance should be verified by measurement of case temperature under the required load and environmental conditions. No insulating hardware is required when using the OPA2541. Since mica and other similar insulators typically add 0.7 °C/W thermal resistance, this is a significant advantage. See Burr-Brown Application Note AN-83 for further details on heat sinking. SAFE OPERATING AREA The Safe Operating Area (SOA) curve provides comprehen- sive information on the power handling abilities of the OPA2541. It shows the allowable output current as a func- tion of the voltage across the conducting output transistor (see Figure 1). This voltage is equal to the power supply voltage minus the output voltage. For example, as the amplifier output swings near the positive power supply voltage, the voltage across the output transistor decreases and the device can safely provide large output currents demanded by the load. INSTALLATION INSTRUCTIONS POWER SUPPLIES The OPA2541 is specified for operation from power sup- plies up to ±40V. It can also be operated from an unbalanced or a single power supply so long as the total power supply voltage does not exceed 80V (70V for “AM” grade). The power supplies should be bypassed with low series imped- ance capacitors such as ceramic or tantalum. These should be located as near as practical to the amplifier’s power supply pins. Good power amplifier circuit layout is, in general, like good high-frequency layout. Consider the path of large power supply and output currents. Avoid routing these connections near low-level input circuitry to avoid waveform distortion and instability. Signal dependent load current can modulate the power supply voltage with inadequate power supply bypassing. This can affect both amplifiers’ outputs. Since the second amplifier’s signal may not be related to the first, this will degrade the inherent channel separation of the OPA2541. HEAT SINKING Most applications will require a heat sink to prevent junction temperatures from exceeding the 150 °C maximum rating. The type of heat sink required will depend on the output signals, power dissipation of each amplifier, and ambient temperature. The thermal resistance from junction-to-case, θ JC, depends on how the power dissipation is distributed on the amplifier die. DC output concentrates the power dissipation in one output transistor. AC output distributes the power dissipation equally between the two output transistors and therefore has lower thermal resistance. Similarly, the power dissipation may be all in one amplifier (worst case) or equally distributed between the two amplifiers (best case). Thermal resistances are provided for each of these possibilities. The case-to- junction temperature rise is the product of the power dissi- Z LOAD = 4700pF, VS = ±35V, AV = +1 DYNAMIC RESPONSE |
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