OPA2277-EP

SBOS700 – DECEMBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

36

V

Input voltage

(V–) – 0.7

(V+) + 0.7

V

Continuous

Operating temperature

–55

125

°C

Junction temperature

150

°C

Lead temperature (soldering, 10 s)

300

°C

Storage temperature range

–55

125

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

One channel per package.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

Machine model (MM)

±100

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Specified voltage range

±5

±15

V

Operating voltage range

±2

±18

V

Operating junction temperature

–55

125

°C

7.4 Thermal Information

OPA2277

D

UNIT

8 PINS

Junction-to-ambient thermal resistance

91.9

Junction-to-case (top) thermal resistance

39.9

Junction-to-board thermal resistance

40.6

°C/W

Junction-to-top characterization parameter

3.9

Junction-to-board characterization parameter

39.6

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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