ISO122

SBOS160A – NOVEMBER 1993 – REVISED JANUARY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

±18

V

100

V

Continuous isolation voltage

1500

Vrms

Junction temperature

150

°C

Output short to common

Continuous

–40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±1000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

TA

–25

85

°C

+VS1

15

-VS1

–15

+VS2

15

-VS2

–15

VIN

±10

7.4 Thermal Information

ISO122

NVF (PDIP)

DVA (SOIC)

UNIT

16 PINS

28 PINS

Junction-to-ambient thermal resistance

51.0

79.8

Junction-to-case (top) thermal resistance

32.4

32.9

Junction-to-board thermal resistance

29.5

42.2

°C/W

Junction-to-top characterization parameter

10.4

6.6

Junction-to-board characterization parameter

29.0

40.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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