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INA301-Q1

SBOS786A – APRIL 2016 – REVISED JUNE 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

Input voltage can exceed the voltage shown without causing damage to the device if the current at that pin is limited to 5 mA.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

6

V

Analog inputs (IN+, IN–)

(2)

–40

40

V

GND – 0.3

40

Analog input

LIMIT pin

GND – 0.3

V

Analog output

OUT pin

GND – 0.3

V

Digital input

RESET pin

GND – 0.3

V

Digital output

ALERT pin

GND – 0.3

6

V

–55

150

°C

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input voltage

12

V

Operating supply voltage

2.7

5

5.5

V

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

INA301-Q1

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

161.5

°C/W

Junction-to-case (top) thermal resistance

62.3

°C/W

Junction-to-board thermal resistance

81.4

°C/W

Junction-to-top characterization parameter

6.8

°C/W

Junction-to-board characterization parameter

80

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W