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MSP430FR2111IRLLT Datasheet(PDF) 4 Page - Texas Instruments |
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MSP430FR2111IRLLT Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 75 page  4 MSP430FR2111, MSP430FR2110 SLASE78A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com Submit Documentation Feedback Product Folder Links: MSP430FR2111 MSP430FR2110 Revision History Copyright © 2016, Texas Instruments Incorporated Table of Contents 1 Device Overview ......................................... 1 1.1 Features .............................................. 1 1.2 Applications ........................................... 1 1.3 Description ............................................ 2 1.4 Functional Block Diagram ............................ 3 2 Revision History ......................................... 4 3 Device Comparison ..................................... 5 3.1 Related Products ..................................... 5 4 Terminal Configuration and Functions .............. 6 4.1 Pin Diagrams ......................................... 6 4.2 Pin Attributes ......................................... 7 4.3 Signal Descriptions ................................... 9 4.4 Pin Multiplexing ..................................... 11 4.5 Connection of Unused Pins ......................... 11 4.6 Buffer Type .......................................... 11 5 Specifications ........................................... 12 5.1 Absolute Maximum Ratings ........................ 12 5.2 ESD Ratings ........................................ 12 5.3 Recommended Operating Conditions ............... 12 5.4 Active Mode Supply Current Into VCC Excluding External Current ..................................... 13 5.5 Active Mode Supply Current Per MHz .............. 13 5.6 Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current .......................... 13 5.7 Low-Power Mode LPM3, LPM4 Supply Currents (Into VCC) Excluding External Current .............. 14 5.8 Typical Characteristics – LPM3 Supply Currents ... 14 5.9 Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current .................... 15 5.10 Typical Characteristics – LPMx.5 Supply Currents . 15 5.11 Typical Characteristics - Current Consumption Per Module .............................................. 15 5.12 Thermal Resistance Characteristics ................ 16 5.13 Timing and Switching Characteristics ............... 16 6 Detailed Description ................................... 34 6.1 Overview ............................................ 34 6.2 CPU ................................................. 34 6.3 Operating Modes .................................... 34 6.4 Interrupt Vector Addresses .......................... 36 6.5 Memory Organization ............................... 37 6.6 Bootloader (BSL) .................................... 37 6.7 JTAG Standard Interface ............................ 37 6.8 Spy-Bi-Wire Interface (SBW) ........................ 38 6.9 FRAM ................................................ 38 6.10 Memory Protection .................................. 38 6.11 Peripherals .......................................... 38 6.12 Device Descriptors (TLV) ........................... 56 6.13 Identification ......................................... 57 7 Applications, Implementation, and Layout ........ 58 7.1 Device Connection and Layout Fundamentals ...... 58 7.2 Peripheral- and Interface-Specific Design Information .......................................... 61 7.3 Typical Applications ................................. 62 8 Device and Documentation Support ............... 63 8.1 Getting Started and Next Steps ..................... 63 8.2 Device Nomenclature ............................... 63 8.3 Tools and Software ................................. 65 8.4 Documentation Support ............................. 67 8.5 Related Links ........................................ 68 8.6 Community Resources .............................. 68 8.7 Trademarks .......................................... 68 8.8 Electrostatic Discharge Caution ..................... 68 8.9 Glossary ............................................. 68 9 Mechanical, Packaging, and Orderable Information .............................................. 69 2 Revision History Changes from August 11, 2016 to August 12, 2016 Page • Changed document status from Product Preview to Production Data ......................................................... 1 |
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