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MSP430FR2111IRLLT Datasheet(PDF) 2 Page - Texas Instruments |
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MSP430FR2111IRLLT Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 75 page  2 MSP430FR2111, MSP430FR2110 SLASE78A – AUGUST 2016 – REVISED AUGUST 2016 www.ti.com Submit Documentation Feedback Product Folder Links: MSP430FR2111 MSP430FR2110 Device Overview Copyright © 2016, Texas Instruments Incorporated 1.3 Description MSP430FR211x devices are an expansion of the MSP430™ microcontroller (MCU) value line to the MSP430FRx FRAM-based MCU family with up to 50x the RAM of comparable 8-bit MCUs in a 3-×3-mm2 package. This ultra-low-power MCU family consists of several devices featuring embedded unified memory, which eliminates the need for assembly programming, making it easier to upgrade 8-bit designs in C and take advantage of the benefits of FRAM and integrated peripherals targeted at various applications. The architecture, FRAM, and peripherals, combined with extensive low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption. Additionally, existing designs on the MSP430G2x family can migrate to the MSP430F211x family to increase performance and get the benefits of FRAM. The MSP430FR211x MCU features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) also allows the device to wake up from low-power modes to active mode typically in less than 10 µs. The feature-set of this MCU meets the needs of applications ranging from smoke detectors to power tool battery protection and fitness accessories. (1) For the most current part, package, and ordering information, see the Package Option Addendum in Section 9, or see the TI website at www.ti.com. (2) The sizes shown here are approximations. For the package dimensions with tolerances, see the Mechanical Data in Section 9. Device Information(1) PART NUMBER PACKAGE BODY SIZE(2) MSP430FR2111PW16 TSSOP (16) 5 mm × 4.4 mm MSP430FR2110PW16 MSP430FR2111RLL QFN (24) 3 mm × 3 mm MSP430FR2110RLL CAUTION System-level ESD protection must be applied in compliance with the device- level ESD specification to prevent electrical overstress or disturbing of data or code memory. See MSP430™ System-Level ESD Considerations for more information. |
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