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MCP1640T-ICHY Datasheet(PDF) 9 Page - Microchip Technology |
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MCP1640T-ICHY Datasheet(HTML) 9 Page - Microchip Technology |
9 / 32 page ![]() 2010-2015 Microchip Technology Inc. DS20002234D-page 9 MCP1640/B/C/D 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. 3.1 Feedback Voltage Pin (VFB) The VFB pin is used to provide output voltage regulation by using a resistor divider. Feedback voltage will be 1.21V typical with the output voltage in regulation. 3.2 Signal Ground Pin (SGND) The signal ground pin is used as a return for the integrated VREF and error amplifier. In the 2x3 DFN package, the SGND and power ground (PGND) pins are connected externally. 3.3 Power Ground Pin (PGND) The power ground pin is used as a return for the high-current N-Channel switch. In the 2x3 DFN package, the PGND and SGND pins are connected externally. 3.4 Enable Pin (EN) The EN pin is a logic-level input used to enable or disable device switching and lower quiescent current while disabled. A logic high (>90% of VIN) will enable the regulator output. A logic low (<20% of VIN) will ensure that the regulator is disabled. 3.5 Switch Node Pin (SW) Connect the inductor from the input voltage to the SW pin. The SW pin carries inductor current and can be as high as 800 mA peak. The integrated N-Channel switch drain and integrated P-Channel switch source are internally connected at the SW node. 3.6 Output Voltage Power Pin (VOUTP) The output voltage power pin connects the output voltage to the switch node. High current flows through the integrated P-Channel and out of this pin to the output capacitor and the output. In the 2x3 DFN package, VOUTP and VOUTS are connected externally. 3.7 Output Voltage Sense Pin (VOUTS) The output voltage sense pin connects the regulated output voltage to the internal bias circuits. In the 2x3 DFN package, the VOUTS and output voltage power (VOUTP) pins are connected externally. 3.8 Power Supply Input Voltage Pin (VIN) Connect the input voltage source to VIN. The input source should be decoupled to GND with a 4.7 µF minimum capacitor. 3.9 Exposed Thermal Pad (EP) There is no internal electrical connection between the Exposed Thermal Pad (EP) and the SGND and PGND pins. They must be connected to the same potential on the Printed Circuit Board (PCB). 3.10 Ground Pin (GND) The ground or return pin is used for circuit ground connection. Length of trace from input cap return, output cap return, and GND pin should be made as short as possible to minimize noise on the GND pin. In the SOT-23-6 package, a single ground pin is used. 3.11 Output Voltage Pin (VOUT) The output voltage pin connects the integrated P-Channel MOSFET to the output capacitor. The FB voltage divider is also connected to the VOUT pin for voltage regulation. TABLE 3-1: PIN FUNCTION TABLE MCP1640/B/C/D 2x3 DFN MCP1640/B/C/D SOT-23 Symbol Description 14 VFB Feedback Voltage Pin 2— SGND Signal Ground Pin 3— PGND Power Ground Pin 4 3 EN Enable Control Input Pin 5 1 SW Switch Node, Boost Inductor Input Pin 6— VOUTP Output Voltage Power Pin 7— VOUTS Output Voltage Sense Pin 86 VIN Input Voltage Pin 9 — EP Exposed Thermal Pad (EP); must be connected to VSS — 2 GND Ground Pin —5 VOUT Output Voltage Pin |
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