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MCP1703A Datasheet(PDF) 15 Page - Microchip Technology |
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MCP1703A Datasheet(HTML) 15 Page - Microchip Technology |
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15 / 31 page  2012-2013 Microchip Technology Inc. DS20005122B-page 15 MCP1703A 6.3 Voltage Regulator Internal power dissipation, junction temperature rise, junction temperature and maximum power dissipation are calculated in the following example. As a result of ground current, the power dissipation is small enough to be neglected. 6.3.1 POWER DISSIPATION EXAMPLE Device Junction Temperature Rise The internal junction temperature rise is a function of internal power dissipation and the thermal resistance from junction to ambient for the application. The thermal resistance from junction to ambient (RθJA) is derived from an EIA/JEDEC standard for measuring thermal resistance for small surface mount packages. The EIA/JEDEC specification is JESD51-7, “High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages”. The standard describes the test method and board specifications for measuring the thermal resistance from junction to ambient. The actual thermal resistance for a particular application can vary depending on many factors, such as copper area and thickness. Refer to AN792, “A Method to Determine How Much Power a SOT23 Can Dissipate in an Application” (DS00792), for more information regarding this subject. Junction Temperature Estimate To estimate the internal junction temperature, the calculated temperature rise is added to the ambient or offset temperature. For this example, the worst-case junction temperature is estimated below. Maximum Package Power Dissipation at +40°C Ambient Temperature Assuming Minimal Copper Usage. 6.4 Voltage Reference The MCP1703A can be used not only as a regulator but also as a low quiescent current voltage reference. In many microcontroller applications, the initial accuracy of the reference can be calibrated using production test equipment or by using a ratio measurement. When the initial accuracy is calibrated, the thermal stability and line regulation tolerance are the only errors introduced by the MCP1703A LDO. The low-cost, low quiescent current and small ceramic output capacitor are all advantages when using the MCP1703A as a voltage reference. FIGURE 6-2: Using the MCP1703A as a Voltage Reference. Package Package Type: SOT-23A Input Voltage: VIN = 2.7V to 4.8V LDO Output Voltages and Currents VOUT =1.8V IOUT =50 mA Maximum Ambient Temperature TA(MAX) = +40°C Internal Power Dissipation Internal Power dissipation is the product of the LDO output current multiplied by the voltage across the LDO (VIN to VOUT). PLDO(MAX) =(VIN(MAX) - VOUT(MIN)) x IOUT(MAX) PLDO = (4.8V - (0.97 x 1.8V)) x 50 mA PLDO = 152.7 milli-Watts TJ(RISE) =PTOTAL x RθJA TJ(RISE) = 152.7 milli-Watts x 336.0°C/Watt TJ(RISE) = 51.3°C TJ =TJ(RISE) + TA(MAX) TJ = 91.3°C SOT-23A (336.0°C/Watt = RθJA) PD(MAX) = (+125°C - 40°C) / 336°C/W PD(MAX) = 253 milli-Watts SOT-89 (153.3°C/Watt = RθJA) PD(MAX) = (+125°C - 40°C) / 153.3°C/W PD(MAX) = 0.554 Watts SOT-223 (62.9°C/Watt = RθJA) PD(MAX) = (+125°C - 40°C) / 62.9°C/W PD(MAX) = 1.35 Watts PIC® GND VIN CIN 1µF COUT 1µF Bridge Sensor VOUT VREF ADO AD1 Ratio Metric Reference 2 µA Bias Microcontroller MCP1703A |
Similar Part No. - MCP1703A_13 |
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Similar Description - MCP1703A_13 |
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