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TMDS181I Datasheet(PDF) 2 Page - Texas Instruments |
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TMDS181I Datasheet(HTML) 2 Page - Texas Instruments |
2 / 59 page 2 TMDS181, TMDS181I SLASE75C – AUGUST 2015 – REVISED JULY 2016 www.ti.com Product Folder Links: TMDS181 TMDS181I Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 4 6 Specifications......................................................... 6 6.1 Absolute Maximum Ratings ...................................... 6 6.2 ESD Ratings.............................................................. 6 6.3 Recommended Operating Conditions ....................... 7 6.4 Thermal Information .................................................. 8 6.5 Power Supply Electrical Characteristics ................... 8 6.6 TMDS Differential Input Electrical Characteristics .... 9 6.7 TMDS Differential Output Electrical Characteristics ......................................................... 10 6.8 DDC, I2C, HPD, and ARC Electrical Characteristics ......................................................... 11 6.9 Power-Up and Operation Timing Requirements ..... 12 6.10 TMDS Switching Characteristics........................... 13 6.11 HPD Switching Characteristics ............................. 14 6.12 DDC and I2C Switching Characteristics................ 14 6.13 Typical Characteristics .......................................... 15 7 Parameter Measurement Information ................ 15 8 Detailed Description ............................................ 24 8.1 Overview ................................................................. 24 8.2 Functional Block Diagram ....................................... 25 8.3 Feature Description................................................. 25 8.4 Device Functional Modes........................................ 31 8.5 Register Maps ......................................................... 33 9 Application and Implementation ........................ 40 9.1 Application Information............................................ 40 9.2 Typical Applications ................................................ 40 10 Power Supply Recommendations ..................... 47 11 Layout................................................................... 48 11.1 Layout Guidelines ................................................. 48 11.2 Layout Example .................................................... 49 12 Device and Documentation Support ................. 50 12.1 Documentation Support ........................................ 50 12.2 Related Links ........................................................ 50 12.3 Receiving Notification of Documentation Updates 50 12.4 Community Resources.......................................... 50 12.5 Trademarks ........................................................... 50 12.6 Electrostatic Discharge Caution ............................ 50 12.7 Glossary ................................................................ 50 13 Mechanical, Packaging, and Orderable Information ........................................................... 51 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (April 2016) to Revision C Page • Recommended Operating Conditions, Changed the CONTROL PINS section .................................................................... 7 • DDC, I 2C, HPD, and ARC Electrical Characteristics, Changed the DDC AND I2C section ................................................. 11 Changes from Revision A (October 2015) to Revision B Page • Recommended Operating Conditions, Added VIL "Low-level input voltage at HPD, OE" ...................................................... 7 • Recommended Operating Conditions, Moved pin OE From: VIH MIN value of 2 V To: VIH MIN value of 2.6 V ................... 7 • Power-Up and Operation Timing Requirements, Deleted the VDD_ramp and VCC_ramp MIN values ............................. 12 • Changed Figure 1 ................................................................................................................................................................ 12 • DDC Functional Description , Changed text "address 22h (see Figure 31) through the I2C interface." To: "address 0Bh through the I2C interface." ............................................................................................................................................ 32 • Added Note to 11–400-kbps in Table 6................................................................................................................................ 35 • Added Note to 11–400-kbps in Table 6................................................................................................................................ 36 Changes from Original (August 2015) to Revision A Page • Updated device from product preview to production data ..................................................................................................... 1 • Absolute Maximum Ratings, Changed max value from 1.56 V to VCC + 0.3V; added input current and Min value............. 6 • Absolute Maximum Ratings, Added Max Input Current on Main Link Differential Input pins................................................. 6 • Recommended Operating Conditions, Updated the note showing the values shown are only for Microcontroller driven and not values based upon pull up or pull down resistors. ........................................................................................ 7 • Power Supply Electrical Characteristics, Increased Max Value of ISD2 from 10 to 15mA ................................................... 8 |
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