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DS3883A Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part No. DS3883A
Description  BTL 9-Bit Data Transceiver
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Maker  NSC [National Semiconductor (TI)]
Homepage  http://www.national.com
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DS3883A Datasheet(HTML) 5 Page - National Semiconductor (TI)

   
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Pin Description
Pin Name
Number
Input/
Description
of Pins
Output
A0–A8
9
I/O
TTL TRI-STATE receiver output and driver input
B0–B8
9
I/O
BTL receiver input and driver output
B0GND–B8GND
9
NA
Parallel driver grounds reduce ground bounce due to high current
switching of driver outputs. (Note 11)
CD
1
I
Chip Disable
GND
2
NA
Ground for switching circuits. (Note 11)
LI
1
NA
Power supply for live insertion. Boards that require live insertion should
connect LI to the live insertion pin on the connector. (Note 12)
NC
8
NA
No Connect
QGND
1
NA
Ground for receiver input bandgap reference and non-switching circuits.
(Note 11)
QV
CC
1NA
V
CC supply for bandgap reference and non-switching circuits. (Note 12)
T/R
1
I
Transmit/Receive — transmit (An to Bn), receive (Bn to An)
V
CC
2NA
V
CC supply for switching circuits. (Note 12)
Note 11: The multiplicity of parallel ground paths reduces the effective inductance of bonding wires and leads, which then reduces the noise caused by transients
on the ground path. The various ground pins can be tied together provided that the external ground has low inductance. (i.e., ground plane with power pins and many
signal pins connected to the backplane ground.) If the external ground floats considerably during transients, precautionary steps should be taken to prevent QGND
from moving with reference to the backplane ground. The receiver threshold should have the same ground reference as the signal coming from the backplane. A volt-
age offset between their grounds will degrade the noise margin.
Note 12: The same considerations for ground are used for VCC in reducing lead inductance (see (Note 11) ). QVCC and VCC should be tied together externally. If
live insertion is not supported, the LI pin can be tied together with QVCC and VCC.
CD
T/R
An
Bn (BTL)
HX
Z
H
LLL
H
LL
H
L
LH
H
L
LHL
H
X = High or low logic state
Z = High impedance state
L = Low state
H = High state
Package Thermal Characteristics
Linear Feet per
Minute Air Flow
(LFPM)
θ
JA (˚C/W)
44-Pin
PQFP
082
225
68
500
60
900
53
Note 13: The above values are typical values and are different from the Ab-
solute Maximum Rating values, which include guardbands.
www.national.com
5


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