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TLV2474A Datasheet(PDF) 17 Page - Texas Instruments |
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TLV2474A Datasheet(HTML) 17 Page - Texas Instruments |
17 / 64 page www.ti.com CIRCUIT LAYOUT CONSIDERATIONS GENERAL PowerPAD™ DESIGN CONSIDERATIONS TLV2470,, TLV2471 TLV2472, TLV2473 TLV2474, TLV2475, TLV247xA SLOS232E – JUNE 1999 – REVISED JULY 2007 APPLICATION INFORMATION (continued) Figure 35 and Figure 36 show the amplifier forward and reverse isolation in shutdown. The operational amplifier is powered by ±1.35V supplies and configured as a voltage follower (A V= 1). The isolation performance is plotted across frequency using 0.1VPP, 1.5VPP, and 2.5VPP input signals. During normal operation, the amplifier would not be able to handle a 2.5VPP input signal with a supply voltage of ±1.35V since it exceeds the common-mode input voltage range (VICR). However, this curve illustrates that the amplifier remains in shutdown even under a worst case scenario. To achieve the levels of high performance of the TLV247x, follow proper printed circuit board (PCB) design techniques. A general set of guidelines is given below: • Ground planes—It is highly recommended that a ground plane be used on the board to provide all components with a low inductive ground connection. However, in the areas of the amplifier inputs and output, the ground plane can be removed to minimize the stray capacitance. • Proper power supply decoupling—Use a 6.8μF tantalum capacitor in parallel with a 0.1μF ceramic capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers depending on the application, but a 0.1 μF ceramic capacitor should always be used on the supply terminal of every amplifier. In addition, the 0.1 μF capacitor should be placed as close as possible to the supply terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less effective. The designer should strive for distances of less than 0.1 inches between the device power terminals and the ceramic capacitors. • Sockets—Sockets can be used but are not recommended. The additional lead inductance in the socket pins will often lead to stability problems. Surface-mount packages soldered directly to the printed-circuit board is the best implementation. • Short trace runs/compact part placements—Optimum high performance is achieved when stray series inductance has been minimized. To realize this, the circuit layout should be made as compact as possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of the amplifier. Its length should be kept as short as possible. This will help to minimize stray capacitance at the input of the amplifier. • Surface-mount passive components—Using surface-mount passive components is recommended for high-performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be kept as short as possible. The TLV247x is available in a thermally-enhanced PowerPAD family of packages. These packages are constructed using a downset leadframe upon which the die is mounted (see Figure 46a and Figure 46b). This arrangement results in the lead frame being exposed as a thermal pad on the underside of the package (see Figure 46c). Because this thermal pad has direct thermal contact with the die, excellent thermal performance can be achieved by providing a good thermal path away from the thermal pad. The PowerPAD package allows for both assembly and thermal management in one manufacturing operation. During the surface-mount solder operation (when the leads are being soldered), the thermal pad must be soldered to a copper area underneath the package. Through the use of thermal paths within this copper area, heat can be conducted away from the package into either a ground plane or other heat dissipating device. Soldering the PowerPAD to the PCB is always recommended, even with applications that have low power dissipation. It provides the necessary mechanical and thermal connection between the lead frame die pad and the PCB. The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of surface mount with previously awkward mechanical methods of heatsinking. 17 Submit Documentation Feedback |
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