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LP8340CLD-3.3 Datasheet(PDF) 7 Page - National Semiconductor (TI) |
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LP8340CLD-3.3 Datasheet(HTML) 7 Page - National Semiconductor (TI) |
7 / 14 page LP8340I Electrical Characteristics (Continued) Unless otherwise specified all limits guaranteed for V IN =VO+ 1V, CIN =COUT = 10µF, TJ = 25˚C. Boldface limits apply over the full operating temperature range of T J = −40˚C to 125˚C Symbol Parameter Conditions Min (Note 5) Typ (Note 4) Max (Note 5) Units T SD Thermal Shutdown Temp. Thermal Shutdown Hyst. 160 10 ˚C ADJ Input Leakage Current V ADJ = 1.5V or 0V ±0.01 ±100 nA V OUT Leakage Current LP8340-ADJ ADJ = OUT, V OUT = 2V, VIN = 10V 10 µA LP8340-1.8, V OUT = 2.5V, VIN = 10V 10 LP8340-2.5, V OUT = 3.5V, VIN = 10V 10 LP8340-3.3, V OUT = 4V, VIN = 10V 10 LP8340-5.0, V OUT = 6V, VIN = 10V 10 e n Output Noise 10Hz to 10kHz, R L =1k Ω,C OUT = 10µF 250 µVrms Note 1: Absolute Maximum ratings indicate limits beyond which damage may occur. Electrical specifications do not apply when operating the device outside of its rated operating conditions. Note 2: All voltages are with respect to the potential at the ground pin. Note 3: Maximum Power dissipation for the device is calculated using the following equations: where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. The value of the θJA for the LLP package is specifically dependant on the PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the LLP package, refer to Application Note AN-1187. Note 4: Typical Values represent the most likely parametric norm. Note 5: All limits are guaranteed by testing or statistical analysis. Note 6: Human body model 1.5k Ω in series with 100pF. Note 7: Condition does not apply to input voltages below 2.7V since this is the minimum input operating voltage. Note 8: Dropout voltage is measured by reducing VIN until VO drops 100mV from its normal value. www.national.com 7 |
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