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TLV2372IDRG4 Datasheet(PDF) 10 Page - Texas Instruments

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Part No. TLV2372IDRG4
Description  500-關A/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV2372IDRG4 Datasheet(HTML) 10 Page - Texas Instruments

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TLV2370, TLV2371, TLV2372
TLV2373, TLV2374, TLV2375
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
www.ti.com
Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375
Submit Documentation Feedback
Copyright © 2001–2016, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.6 Thermal Information: TLV2373
THERMAL METRIC(1)
TLV2373
UNIT
DGS (VSSOP)
D (SOIC)
P (PDIP)
10 PINS
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
166.5
67
66.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
41.8
24.1
20.5
°C/W
RθJB
Junction-to-board thermal resistance
86.1
22.5
26.8
°C/W
ψJT
Junction-to-top characterization parameter
1.5
2.2
2.1
°C/W
ψJB
Junction-to-board characterization parameter
84.7
22.1
26.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.7 Thermal Information: TLV2374
THERMAL METRIC(1)
TLV2374
UNIT
D (SOIC)
N (PDIP)
PW (TSSOP)
14 PINS
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
67
66.3
121
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
24.1
20.5
49.4
°C/W
RθJB
Junction-to-board thermal resistance
22.5
26.8
62.8
°C/W
ψJT
Junction-to-top characterization parameter
2.2
2.1
5.9
°C/W
ψJB
Junction-to-board characterization parameter
22.1
26.2
62.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.8 Thermal Information: TLV2375
THERMAL METRIC(1)
TLV2375
UNIT
D (SOIC)
N (PDIP)
PW (TSSOP)
16 PINS
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
83
55.8
115.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
44
43.1
50.5
°C/W
RθJB
Junction-to-board thermal resistance
40.5
35.8
60.7
°C/W
ψJT
Junction-to-top characterization parameter
11.5
27.9
7.4
°C/W
ψJB
Junction-to-board characterization parameter
40.2
35.7
60.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
°C/W


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