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TLV2372IDGKRG4 Datasheet(PDF) 28 Page - Texas Instruments

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Part No. TLV2372IDGKRG4
Description  500-關A/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown
Download  58 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV2372IDGKRG4 Datasheet(HTML) 28 Page - Texas Instruments

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55 -40 -25 -10
5
20
35
50
65
80
95 110 125
Temperature ( C)
°
2
1.75
1.5
1.25
1
0.75
0.5
0.25
0
SOT-23 Package
Low-K Test PCB
= 324
q
JA
°
C/W
SOIC Package
Low-K Test PCB
= 176
q
JA
°
C/W
PDIP Package
Low-K Test PCB
= 104
q
JA
°
C/W
MSOP Package
Low-K Test PCB
= 260
q
JA
°
C/W
T = 150 C
J
°
P
=
D
T
T
MAX
A
JA
-
q
N/C
–IN
+IN
V–
N/C
V+
OUTPUT
N/C
Use low-ESR, ceramic
bypass capacitor
GND
VS+
Run the input traces
as far away from
the supply lines
as possible
Place components
close to device and
to eachother to
reduce parasitic
errors
GND
VIN
RF
GND
RG
Use low-ESR,
ceramic bypass
capacitor
VS–
VOUT
Copyright © 2016, Texas Instruments Incorporated
28
TLV2370, TLV2371, TLV2372
TLV2373, TLV2374, TLV2375
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
www.ti.com
Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375
Submit Documentation Feedback
Copyright © 2001–2016, Texas Instruments Incorporated
Layout Example (continued)
Figure 41. Operational Amplifier Board Layout for Noninverting Configuration
11.3 Power Dissipation Considerations
For a given θJA, the maximum power dissipation is shown in Figure 42 and is calculated by Equation 4:
where
PD = Maximum power dissipation of TLV237x IC (watts)
TMAX = Absolute maximum junction temperature (150°C)
TA = Free-ambient air temperature (°C)
θJA = θJC (Thermal coefficient from junction to case) + θCA (Thermal coefficient from case to ambient air (°C/W))
(4)
Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 42. Maximum Power Dissipation vs Free-Air Temperature


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