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TLV2372IDGKR Datasheet(PDF) 9 Page - Texas Instruments

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Part No. TLV2372IDGKR
Description  500-關A/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV2372IDGKR Datasheet(HTML) 9 Page - Texas Instruments

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TLV2370, TLV2371, TLV2372
TLV2373, TLV2374, TLV2375
www.ti.com
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375
Submit Documentation Feedback
Copyright © 2001–2016, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.3 Thermal Information: TLV2370
THERMAL METRIC(1)
TLV2370
UNIT
DBV (SOT-23)
D (SOIC)
P (PDIP)
6 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
228.5
138.4
49.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
99.1
89.5
39.4
°C/W
RθJB
Junction-to-board thermal resistance
54.6
78.6
26.4
°C/W
ψJT
Junction-to-top characterization parameter
7.7
29.9
15.4
°C/W
ψJB
Junction-to-board characterization parameter
53.8
78.1
26.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information: TLV2371
THERMAL METRIC(1)
TLV2371
UNIT
DBV (SOT-23)
D (SOIC)
P (PDIP)
5 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
228.5
138.4
49.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
99.1
89.5
39.4
°C/W
RθJB
Junction-to-board thermal resistance
54.6
78.6
26.4
°C/W
ψJT
Junction-to-top characterization parameter
7.7
29.9
15.4
°C/W
ψJB
Junction-to-board characterization parameter
53.8
78.1
26.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Thermal Information: TLV2372
THERMAL METRIC(1)
TLV2372
UNIT
D (SOIC)
DGK (VSSOP)
P (PDIP)
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
138.4
191.2
49.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
89.5
61.9
39.4
°C/W
RθJB
Junction-to-board thermal resistance
78.6
111.9
26.4
°C/W
ψJT
Junction-to-top characterization parameter
29.9
5.1
15.4
°C/W
ψJB
Junction-to-board characterization parameter
78.1
110.2
26.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
°C/W


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