Bottom View

Top View

B1

A1

B2

A2

GND

B1

A1

B2

A2

GND

LP5990

SNVS438B – APRIL 2007 – REVISED DECEMBER 2007

www.ti.com

CONNECTION DIAGRAMS

Figure 1. 4-Bump Thin DSBGA Package, 0.4mm pitch

Package Number YFQ0004CEA

The actual physical placement of the package marking will vary from part to part.

PIN DESCRIPTIONS

Pin No.

Symbol

Name and Function

DSBGA

A2

Enable input; disables the regulator when

≤ 0.35V. Enables the regulator when ≥ 1.0V.

A1

GND

Common ground.

B1

Output voltage. A 1.0

μF Low ESR capacitor should be connected to this Pin. Connect

this output to the load circuit.

B2

Input voltage supply. A 1.0 µF capacitor should be connected at this input.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

-0.3 to 6.0V

-0.3 to 6.0V (max)

Internally Limited

150°C

Storage Temperature Range

-65 to 150°C

Maximum Lead Temperature (Soldering, 10 sec.)

260°C

Human Body Model

2 kV

Machine Model

200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage.

(5)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

2

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