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5962-9688201Q2A Datasheet(PDF) 4 Page - Texas Instruments |
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5962-9688201Q2A Datasheet(HTML) 4 Page - Texas Instruments |
4 / 19 page TLV2354, TLV2354Y LinCMOS ™ QUADRUPLE LOW-VOLTAGE DIFFERENTIAL COMPARATORS SLCS012C – MAY 1992 – REVISED AUGUST 2000 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV2354Y chip information This chip, when properly assembled, displays characteristics similar to the TLV2354. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with conductive epoxy or a gold-silicon preform. CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (11) INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – OUT IN + IN – VDD GND (10) (7) (6) (11) (1) – + (13) IN + IN – OUT (12) (4) (5) – + (2) + – (9) (8) (14) OUT IN + IN – OUT IN + IN – (3) BONDING PAD ASSIGNMENTS 65 90 (13) (1) (3) (4) (5) (6) (7) (8) (9) (10) (11) (12) (14) (2) |
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