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TLC59283 Datasheet(PDF) 2 Page - Texas Instruments |
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TLC59283 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 29 page TLC59283 SBVS199B – JUNE 2012 – REVISED OCTOBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE AND ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD ORDERING NUMBER TRANSPORT MEDIA, QUANTITY TLC59283DBQR Tape and Reel, 2500 TLC59283 SSOP-24 and QSOP-24 TLC59283DBQ Tube, 50 TLC59283RGER Tape and Reel, 3000 TLC59283 QFN-24 TLC59283RGE Tape and Reel, 250 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) (2) Over operating free-air temperature range, unless otherwise noted. VALUE UNIT MIN MAX VCC Supply –0.3 +6 V VIN Input range, SIN, SCLK, LAT, BLANK, IREF –0.3 VCC + 0.3 V Voltage Output range, SOUT –0.3 VCC + 0.3 V VOUT Output range, OUT0 to OUT15 –0.3 +11 V Current IOUT Output (dc), OUT0 to OUT15 +50 mA TJ(MAX) Operating junction +150 °C Temperature Tstg Storage range –55 +150 °C Human body model (HBM) 3000 V Electrostatic discharge ratings ESD Charged device model (CDM) 2000 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) All voltage values are with respect to network ground terminal. THERMAL INFORMATION TLC59283 THERMAL METRIC(1) DBQ RGE UNITS 24 PINS 24 PINS θJA Junction-to-ambient thermal resistance 91.5 42.9 θJCtop Junction-to-case (top) thermal resistance 55.2 55.3 θJB Junction-to-board thermal resistance 44.9 21.7 °C/W ψJT Junction-to-top characterization parameter 16.8 1.9 ψJB Junction-to-board characterization parameter 44.5 21.8 θJCbot Junction-to-case (bottom) thermal resistance N/A 8.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: TLC59283 |
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