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TLC5946PWP Datasheet(PDF) 2 Page - Texas Instruments |
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TLC5946PWP Datasheet(HTML) 2 Page - Texas Instruments |
2 / 41 page ABSOLUTE MAXIMUM RATINGS (1) (2) DISSIPATION RATINGS TLC5946 SLVS824B – MARCH 2008 – REVISED JUNE 2008 .......................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD ORDERING NUMBER TLC5946 TSSOP-28 TLC5946PW TLC5946 HTSSOP-28 PowerPAD™ TLC5946PWP TLC5946 5 mm × 5 mm QFN-32 TLC5946RHB (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Over operating free-air temperature range, unless otherwise noted. PARAMETER TLC5946 UNIT VCC Supply voltage: VCC –0.3 to +6.0 V OUT0 to OUT15 50 mA IOUT Output current (dc) XERR 6 mA Input voltage range: SIN, SCLK, GSCLK, XLAT, BLANK, MODE, XHALF, VIN –0.3 to VCC + 0.3 V IREF SOUT, XERR –0.3 to VCC + 0.3 V VOUT Output voltage range OUT0 to OUT15 –0.3 to +18 V TJ(ABS) Operating temperature range: junction temperature –40 to +150 °C TSTG Storage temperature range –55 to +150 °C Human body model (HBM), 2 kV JEDEC JESD22-A114 ESD rating Charged device model (CDM), 500 V JEDEC JESD22-C101 (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) All voltage values are with respect to network ground terminal. OPERATING FACTOR TA < +25°C TA = +70°C TA = +85°C PACKAGE ABOVE TA = +25°C POWER RATING POWER RATING POWER RATING TSSOP-28 16.21 mW/°C 2026 mW 1296 mW 1053 mW HTSSOP-28 with 31.67 mW/°C 3958 mW 2533 mW 2058 mW PowerPAD soldered(1) HTSSOP-28 with 16.21 mW/°C 2026 mW 1296 mW 1053 mW PowerPAD not soldered(2) QFN-32(3) 27.86 mW/°C 3482 mW 2228 mW 1811 mW (1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available for download at www.ti.com). (2) With PowerPAD not soldered onto copper area on PCB. (3) The package thermal impedance is calculated in accordance with JESD51-5. 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TLC5946 |
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