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TLC5929 Datasheet(PDF) 2 Page - Texas Instruments

Part # TLC5929
Description  16-Channel, Constant-Current LED Driver with 7-Bit Global Brightness Control, Power-Save Mode, and Full Self-Diagnosis for LED Lamp
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLC5929 Datasheet(HTML) 2 Page - Texas Instruments

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TLC5929
SBVS159B – APRIL 2011 – REVISED JULY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PACKAGE
ORDERING
TRANSPORT MEDIA,
PRODUCT
PACKAGE-LEAD
DESIGNATOR
NUMBER
QUANTITY
TLC5929DBQR
Tape and Reel, 2500
SSOP/QSOP-24
DBQ
TLC5929DBQ
Tube, 50
TLC5929PWPR
Tape and Reel, 2000
TLC5929
HTSSOP-24 PowerPAD™
PWP
TLC5929PWP
Tube, 60
TLC5929RGER
Tape and Reel, 3000
QFN-24
RGE
TLC5929RGE
Tape and Reel, 250
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
MIN
MAX
UNIT
VCC
–0.3
+6.0
V
Voltage(2)
SIN, SCLK, LAT, BLANK, IREF, SOUT
–0.3
VCC + 0.3
V
OUT0 to OUT15
–0.3
+11
V
Current
OUT0 to OUT15
0
+65
mA
Operating junction, TJ (max)
–40
+150
°C
Temperature
Storage, TSTG
–55
+150
°C
Human body model (HBM)
4000
V
Electrostatic Discharge Ratings
Charged device model (CDM)
2000
V
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2)
All voltages are with respect to device ground terminal.
THERMAL INFORMATION
TLC5929
THERMAL METRIC(1)
DBQ
PWP
RGE
UNITS
24 PINS
24 PINS
24 PINS
θJA
Junction-to-ambient thermal resistance
85.3
37.6
38.1
θJCtop
Junction-to-case (top) thermal resistance
48.8
24.5
45.3
θJB
Junction-to-board thermal resistance
38.6
11.5
16.9
°C/W
ψJT
Junction-to-top characterization parameter
11.9
0.5
0.9
ψJB
Junction-to-board characterization parameter
38.3
11.3
16.9
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
5.7
6.2
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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Copyright © 2011–2012, Texas Instruments Incorporated
Product Folder Link(s): TLC5929


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