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TLC5929 Datasheet(PDF) 2 Page - Texas Instruments |
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TLC5929 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 43 page TLC5929 SBVS159B – APRIL 2011 – REVISED JULY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PACKAGE ORDERING TRANSPORT MEDIA, PRODUCT PACKAGE-LEAD DESIGNATOR NUMBER QUANTITY TLC5929DBQR Tape and Reel, 2500 SSOP/QSOP-24 DBQ TLC5929DBQ Tube, 50 TLC5929PWPR Tape and Reel, 2000 TLC5929 HTSSOP-24 PowerPAD™ PWP TLC5929PWP Tube, 60 TLC5929RGER Tape and Reel, 3000 QFN-24 RGE TLC5929RGE Tape and Reel, 250 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE MIN MAX UNIT VCC –0.3 +6.0 V Voltage(2) SIN, SCLK, LAT, BLANK, IREF, SOUT –0.3 VCC + 0.3 V OUT0 to OUT15 –0.3 +11 V Current OUT0 to OUT15 0 +65 mA Operating junction, TJ (max) –40 +150 °C Temperature Storage, TSTG –55 +150 °C Human body model (HBM) 4000 V Electrostatic Discharge Ratings Charged device model (CDM) 2000 V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. (2) All voltages are with respect to device ground terminal. THERMAL INFORMATION TLC5929 THERMAL METRIC(1) DBQ PWP RGE UNITS 24 PINS 24 PINS 24 PINS θJA Junction-to-ambient thermal resistance 85.3 37.6 38.1 θJCtop Junction-to-case (top) thermal resistance 48.8 24.5 45.3 θJB Junction-to-board thermal resistance 38.6 11.5 16.9 °C/W ψJT Junction-to-top characterization parameter 11.9 0.5 0.9 ψJB Junction-to-board characterization parameter 38.3 11.3 16.9 θJCbot Junction-to-case (bottom) thermal resistance N/A 5.7 6.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Link(s): TLC5929 |
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Similar Description - TLC5929_16 |
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