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LP3990TL-0.8/NOPB Datasheet(PDF) 4 Page - Texas Instruments |
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LP3990TL-0.8/NOPB Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page LP3990 SNVS251J – MAY 2004 – REVISED SEPTEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) (3) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Input voltage –0.3 6.5 Output voltage –0.3 Note(4) V ENABLE input voltage –0.3 6.5 Continuous power dissipation internally limited Note(5) (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (3) All voltages are with respect to the potential at the GND pin. (4) The lower of VIN + 0.3 V or 6.5 V. (5) Internal thermal shutdown circuitry protects the device from permanent damage. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –2000 2000 pins(1) V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification JESD22- V 250 1500 C101, all pins Machine model –200 200 (1) JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Input voltage, VIN 2 6 V Enable input voltage, VEN 0.0 VIN Junction temperature, TJ (1) –40 125 °C (1) TJ(max) = (TA(max) + (RθJA × PD(max)) ) 6.4 Thermal Information LP3990 THERMAL METRIC(1) YZR (DSBGA) DBV (SOT-23) NGG (WSON) UNIT 4 PINS 5 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 188.9 165.2 53.9 RθJC(top) Junction-to-case (top) thermal resistance 1.0 69.9 51.2 RθJB Junction-to-board thermal resistance 105.3 27.3 28.2 °C/W ψJT Junction-to-top characterization parameter 0.7 1.8 0.6 ψJB Junction-to-board characterization parameter 105.2 26.8 28.3 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 8.1 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2004–2014, Texas Instruments Incorporated Product Folder Links: LP3990 |
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