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LP3995ILD-2.8/NOPB Datasheet(PDF) 4 Page - Texas Instruments |
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LP3995ILD-2.8/NOPB Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page LP3995 SNVS179F – FEBRUARY 2003 – REVISED SEPTEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT Input voltage, VIN –0.3 6.5 V Output voltage –0.3 (VIN + 0.3 V) to 6.5 V Enable input voltage –0.3 6.5 V Junction temperature 150 °C Continuous power dissipation(4) Internally limited Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the potential at the GND pin. (3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office / Distributors for availability and specifications. (4) In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(MAX)) is dependant on the maximum operating junction temperature (TJ(MAX-OP)), the maximum power dissipation (PD(MAX)), and the junction-to-ambient thermal resistance in the application (RθJA). This relationship is given by: TA(MAX) = TJ(MAX-OP) − (PD(MAX) × RθJA). 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Machine model ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Input voltage, VIN 2.5 6 V Enable input voltage 0 6 V Junction temperature −40 125 °C Ambient temperature(1) −40 85 °C (1) In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(MAX)) is dependant on the maximum operating junction temperature (TJ(MAX-OP)), the maximum power dissipation (PD(MAX)), and the junction-to-ambient thermal resistance in the application (RθJA). This relationship is given by: TA(MAX) = TJ(MAX-OP) − (PD(MAX) × RθJA). 4 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: LP3995 |
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