Electronic Components Datasheet Search |
|
TLC2652AI-8DR Datasheet(PDF) 3 Page - Texas Instruments |
|
|
TLC2652AI-8DR Datasheet(HTML) 3 Page - Texas Instruments |
3 / 39 page TLC2652, TLC2652A, TLC2652Y Advanced LinCMOS PRECISION CHOPPERSTABILIZED OPERATIONAL AMPLIFIERS SLOS019E − SEPTEMBER 1988 − REVISED FEBRUARY 2005 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC2652Y chip information This chip, when properly assembled, displays characteristics similar to the TLC2652C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (7) IS INTERNALLY CONNECTED TO BACK SIDE OF CHIP. FOR THE PINOUT, SEE THE FUNCTIONAL BLOCK DIAGRAM. 90 80 (13) (12) (11) (10) (9) (8) (1) (7) (5) (4) (2) (14) |
Similar Part No. - TLC2652AI-8DR |
|
Similar Description - TLC2652AI-8DR |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |