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TLC2252MFKB Datasheet(PDF) 2 Page - Texas Instruments

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Part No. TLC2252MFKB
Description  Advanced LinCMOS RAIL-TO-RAIL VERY LOW-POWER OPERATIONAL AMPLIFIERS
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Maker  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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TLC2252MFKB Datasheet(HTML) 2 Page - Texas Instruments

 
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TLC225x, TLC225xA
Advanced LinCMOS
 RAIL-TO-RAIL
VERY LOW-POWER OPERATIONAL AMPLIFIERS
SLOS176D – FEBRUARY 1997 – REVISED MARCH 2001
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC2252 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL
OUTLINE†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP‡
(PW)
CERAMIC
FLATPACK
(U)
0
°C to 70°C
1500
µV
TLC2252CD
TLC2252CP
TLC2252CPW
40
°Cto125°C
850
µV
TLC2252AID
TLC2252AIP
TLC2252AIPW
– 40
°C to 125°C
µ
1500
µV
TLC2252ID
TLC2252IP
40
°Cto125°C
850
µV TLC2252AQD
– 40
°C to 125°C
µ
1500
µV TLC2252QD
– 55
°C to 125°C
850
µV
1500
µV
TLC2252AMFK
TLC2252MFK
TLC2252AMJG
TLC2252MJG
TLC2252AMU
TLC2252MU
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2262CDR).
‡ The PW package is available only left-ended taped and reeled.
§ Chip forms are tested at 25
°C only.
TLC2254 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25
°C
SMALL
OUTLINE†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC DIP
(N)
TSSOP‡
(PW)
CERAMIC
FLATPACK
(W)
0
°C to
70
°C
1500
µV
TLC2254CD
TLC2254CN
TLC2254CPW
– 40
°C to
850
µV
TLC2254AID
TLC2254AIN
TLC2254AIPW
125
°C
µ
1500
µV
TLC2254ID
TLC2254IN
– 40
°C to
850
µV
TLC2254AQD
125
°C
µ
1500
µV
TLC2254QD
– 55
°C to
850
µV
TLC2254AMFK
TLC2254AMJ
TLC2254AMW
125
°C
µ
1500
µV
TLC2254MFK
TLC2254MJ
TLC2254MW
† The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2254CDR).
‡ The PW package is available only left-end taped and reeled. Chips are tested at 25
°C.
§ Chip forms are tested at 25
°C only.


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