DS1556 1M, Nonvolatile, Y2K-Compliant Timekeeping RAM

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AC TEST CONDITIONS

Output Load: 50 pF + 1TTL Gate

Input Pulse Levels:

0.0 to 3.0V

Timing Measurement Reference Levels:

Input: 1.5V

Output: 1.5V

Input Pulse Rise and Fall Times: 5 ns

NOTES:

1. Voltage referenced to ground.

2. Typical values are at +25

°C and nominal supplies.

3. Outputs are open.

5. The

IRQ/FT and RST outputs are open drain.

6. Data-retention time is at +25

°C.

8. RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques

as long as temperature exposure to the lithium energy source contained within does not exceed

+85

°C. Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic

vibration is not used.

In addition, for the PowerCap:

a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through

solder reflow oriented with the label side up (“live-bug”).

b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than

3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove

the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to

remove solder.