LMV7239-Q1 datasheet(4/30 Pages) TI1

Part #	LMV7239-Q1

Description	75-ns, Ultra Low Power, Low Voltage, Rail-to-Rail Input Comparator with Open-Drain and Push-Pull Output

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Manufacturer	TI1 [Texas Instruments]

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4 / 30 page

LMV7235, LMV7239, LMV7239-Q1

SNOS532N – SEPTEMBER 2000 – REVISED APRIL 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

(1)

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Differential Input Voltage

± Supply Voltage

V

Output Short Circuit Duration

See (2)

Supply Voltage (V+ - V−)

6

V

SOLDERING INFORMATION

Infrared or Convection (20 sec)

235

°C

Wave Soldering (10 sec)

260 (lead temp)

°C

Voltage at Input/Output Pins

(V+) +0.3, (V−)

−0.3

V

Current at Input Pin (3)

±10

mA

Storage Temperature, Tstg

-65

150

°C

Junction Temperature,TJ

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term may adversely

affect reliability.

(3)

Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.

6.2 ESD Ratings, LMV7235 and LMV7239

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V(ESD)

Electrostatic discharge

V

Machine model (MM)

±100

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

6.3 ESD Ratings, LMV7239-Q1

VALUE

UNIT

Human-body model (HBM), per AEC Q100-002(1)

±1000

Electrostatic

V(ESD)

Machine model (MM)

±100

V

discharge

Charged-device model (CDM), per AEC Q100-011(1)

DBV package only

±750

(1)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.4 Recommended Operating Conditions

MIN

MAX

UNIT

Supply Voltages (V+ - V−)

2.7

5.5

V

Temperature Range(1)

LMV7235/LMV7239

−40

85

°C

LMV7239Q

−40

125

°C

(1)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA) / θJA. All numbers apply for packages soldered directly onto a PC Board.

6.5 Thermal Information

SC70

SOT-23

THERMAL METRIC(1)

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

478

265

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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Product Folder Links: LMV7235 LMV7239 LMV7239-Q1

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