LP2989

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SNVS083O – FEBRUARY 2005 – REVISED MARCH 2015

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Operating junction temperature

–40

125

°C

Operating input supply voltage

2.1

16

V

6.4 Thermal Information

LP2989

WSON (NGN)

SOIC (D)

VSSOP (DGK)

UNIT

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance, High-K

34.8

114.5

156.5

Junction-to-case (top) thermal resistance

28.4

61.1

51.0

Junction-to-board thermal resistance

12.0

55.6

76.5

°C/W

Junction-to-top characterization parameter

0.2

9.7

4.9

Junction-to-board characterization parameter

12.2

54.9

75.2

Junction-to-case (bottom) thermal resistance

1.3

n/a

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

PARAMETER

TEST CONDITIONS

UNIT

MIN

TYP

MAX

MIN

TYP

MAX

−0.75

0.75

−1.25

1.25

−1.5

1.5

−2.5

2.5

V

Output voltage tolerance

−4

2.5

−5

3.5

V, –40°C

−3.5

2.5

−4.5

3.5

V,

0.005

0.014

0.005

0.014

V

Output voltage line

%/V

regulation

0.005

0.032

0.005

0.032

V, –40°C

0.4

0.4

1

3

1

3

mV

1

4

1

4

125°C

150

200

150

200

mV

150

300

150

300

≤ 125°C

310

425

310

425

mV

310

650

310

650

≤ 125°C

(1)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using

Statistical Quality Control (SQC) methods. The limits are used to calculate TI’s Average Outgoing Quality Level (AOQL).

(2)

Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below the value measured with a

1-V differential.

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