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LP3872EMPX-2.5/NOPB Datasheet(PDF) 4 Page - Texas Instruments |
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LP3872EMPX-2.5/NOPB Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page LP3872, LP3875 SNVS227H – FEBRUARY 2003 – REVISED JANUARY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications. MIN MAX UNIT Lead temperature (soldering, 5 sec.) 260 °C Power dissipation(3) Internally limited IN pin to GND pin voltage −0.3 7.5 V Shutdown (SD) pin to GND pin voltage −0.3 7.5 V OUT pin to GND pin voltage(4), (5) −0.3 6 V IOUT Short-circuit protected ERROR pin to GND pin voltage VIN V SENSE pin to GND pin voltage VOUT V Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings(1)(2) may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. (3) Internal thermal shutdown circuitry protects the device from permanent damage. (4) If used in a dual-supply system where the regulator load is returned to a negative supply, the output must be diode-clamped to ground. (5) The output PMOS structure contains a diode between the IN and OUT pins. This diode is normally reverse biased. This diode will get forward biased if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can typically withstand 200 mA of DC current and 1 A of peak current. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN MAX UNIT VIN supply voltage (1) 2.5 7 V Shutdown (SD) voltage −0.3 7 V Maximum operating current (DC) IOUT 1.5 A Junction temperature –40 125 °C (1) The minimum operating value for VIN is equal to either [VOUT(NOM) + VDROPOUT] or 2.5 V, whichever is greater. 6.4 Thermal Information LP3872, LP3875 LP3875 THERMAL METRIC(1) NDC (SOT-223) KTT (TO-263) NDH (TO-220) UNIT 5 PINS 5 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 65.2 40.3 32 RθJC(top) Junction-to-case (top) thermal resistance 47.2 43.4 43.8 RθJB Junction-to-board thermal resistance 9.9 23.1 18.6 °C/W ψJT Junction-to-top characterization parameter 3.4 11.5 8.8 ψJB Junction-to-board characterization parameter 9.7 22 18 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 1 1.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2003–2015, Texas Instruments Incorporated Product Folder Links: LP3872 LP3875 |
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