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LP2998 Datasheet(PDF) 7 Page - Texas Instruments |
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LP2998 Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 33 page  LP2998, LP2998-Q1 www.ti.com SNVS521K – DECEMBER 2007 – REVISED AUGUST 2014 Electrical Characteristics (continued) Typical limits tested at TJ = 25°C. Minimum and maximum limits apply over the full operating junction temperature range (TJ = –40°C to 125°C). (1) Unless otherwise specified, AVIN = PVIN = 2.5 V, VDDQ = 2.5 V.(2) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IOUT = 0 A –30 0 30 VTT Output Voltage Offset (VREF – IOUT = –1.5 A –30 0 30 VTT) for DDR I (3) IOUT = 1.5 A –30 0 30 IOUT = 0 A –30 0 30 VTT Output Voltage Offset (VREF – IOUT = –0.5 A –30 0 30 VTT) for DDR II (3) VOSVtt mV IOUT = 0.5 A –30 0 30 IOUT = 0 A –30 0 30 IOUT = ±0.2 A –30 0 30 VTT Output Voltage Offset (VREF – VTT) for DDR III (3) IOUT = ±0.4 A –30 0 30 IOUT = ±0.5 A –30 0 30 IQ Quiescent Current (4) IOUT = 0 A 320 500 µA ZVDDQ VDDQ Input Impedance 100 k Ω ISD Quiescent current in shutdown (4) SD = 0 V 115 150 µA IQ_SD Shutdown leakage current SD = 0 V 2 5 VIH Minimum Shutdown High Level 1.9 V VIL Maximum Shutdown Low Level 0.8 SD = 0 V Iv VTT leakage current in shutdown 1 10 µA VTT = 1.25 V ISENSE VSENSE Input current 13 nA TSD Thermal Shutdown (5) 165 °C TSD_HYS Thermal Shutdown Hysteresis 10 (4) Quiescent current defined as the current flow into AVIN. (5) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction to ambient thermal resistance, RθJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature and the regulator will go into thermal shutdown. Copyright © 2007–2014, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: LP2998 LP2998-Q1 |
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