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TL75LP08 Datasheet(PDF) 2 Page - Texas Instruments |
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TL75LP08 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 15 page TL75LPxxQ SERIES TL75LPxxY SERIES LOW DROPOUT VOLTAGE REGULATORS SLVS073A − SEPTEMBER 1992 − REVISED AUGUST 1995 3−2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 functional block diagram INPUT Current Limiting Enable ENABLE Bandgap OUTPUT Overvoltage/ Thermal Shutdown GND/HEAT SINK + − 28 V TL75LPxxY chip information This chip, when properly assembled, displays characteristics similar to the TL75LPxx. Thermal compression or ultrasonic bonding can be used on the doped aluminum bonding pads. The chip can be mounted with conductive epoxy or a gold-silicon preform. (1) (5) (4) TL75LPxxY (3) (6) (2) OUTPUT OUTPUT SENSE SIGNAL GND POWER GND ENABLE INPUT CHIP THICKNESS: 11 MILS TYPICAL BONDING PADS: 7 X 7 MILS MINIMUM TJ max = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. NOTE A. NOTE: SIGNAL GND and POWER GND must be tied together as close to device as possible. OUTPUT and OUTPUT SENSE should be tied together. 92 123 BONDING PAD ASSIGNMENTS (1) (5) (3) (6) (2) (4) |
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Similar Description - TL75LP08 |
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