THS3061

THS3062

SLOS394B – JULY 2002 – REVISED NOVEMBER 2009

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

Over operating free-air temperature range unless otherwise noted.

(1)

Supply voltage

±16.5 V

Input voltage

Output current

200 mA

Differential input voltage

±3 V

Continuous power dissipation

See Dissipation Ratings Table

Maximum junction temperature

+150°C

(2)

Maximum junction temperature, continuous operation, long term reliability

+125°C

Storage temperature range

–65°C to +150°C

(1)

The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may

cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

(2)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device.

PACKAGE DISSIPATION RATINGS

POWER RATING

(2)

PACKAGE

(°C/W)

D (8 pin)

38.3

97.5

1.02 W

410 mW

9.2

45.8

2.18 W

873 mW

4.7

58.4

1.71 W

680 mW

(1)

This data was taken using the JEDEC High-K test PCB.

(2)

This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 in x 3 in PCB.

(3)

The THS306x may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally

dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could

permanently damage the device. See TI technical brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced

package.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Dual supply

±5

±15

Supply voltage

V

Single supply

10

30

2

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Product Folder Link(s): THS3061 THS3062