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LMH6702 Datasheet(PDF) 4 Page - Texas Instruments |
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LMH6702 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page 4 LMH6702 SNOSA03H – NOVEMBER 2002 – REVISED MAY 2016 www.ti.com Product Folder Links: LMH6702 Submit Documentation Feedback Copyright © 2002–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) The maximum output current (IOUT) is determined by device power dissipation limitations. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VS ±6.75 V IOUT See(3) Common mode input voltage V− to V+ V Maximum junction temperature 150 °C Storage temperature −65 150 °C Soldering information Infrared or convection (20 s) 235 °C Wave soldering (10 s) 260 °C (1) Human body model: 1.5 k Ω in series with 100 pF. JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 2000-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. (2) Machine model: 0 Ω in series with 200 pF. JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 200-V MM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Machine Model (MM), per JEDEC specification JESD22-C101, all pins(2) ±200 (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical Characteristics tables. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Operating temperature −40 85 °C Nominal supply voltage ±4 ±6 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). 6.4 Thermal Information THERMAL METRIC(1) LMH6702 UNIT DBV (SOT-23) D (SOIC) 5 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 182 133 °C/W RθJC(top) Junction-to-case (top) thermal resistance 139 79 °C/W RθJB Junction-to-board thermal resistance 40 73 °C/W ψJT Junction-to-top characterization parameter 28 28 °C/W ψJB Junction-to-board characterization parameter 40 73 °C/W |
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