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LMV344-N Datasheet(PDF) 5 Page - Texas Instruments |
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LMV344-N Datasheet(HTML) 5 Page - Texas Instruments |
5 / 35 page 5 LMV341-N, LMV342-N, LMV344-N www.ti.com SNOS990H – APRIL 2002 – REVISED JUNE 2016 Product Folder Links: LMV341-N LMV342-N LMV344-N Submit Documentation Feedback Copyright © 2002–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Shorting output to V+ will adversely affect reliability. (4) Shorting output to V- will adversely affect reliability. (5) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA) / RθJA. All numbers apply for packages soldered directly onto a PCB. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Differential input voltage ±Supply voltage Supply voltage (V + – V –) 6 V Output short circuit to V + See(3) Output short circuit to V – See(4) Lead temperature Infrared or convection reflow (20 s) 235 °C Wave soldering (10 s) 260 Junction temperature, TJ (5) 150 °C Storage temperature, Tstg –65 150 °C (1) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. (2) Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22- C101-C (ESD FICDM std. of JEDEC). 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM)(1) ±2000 V Machine model (MM)(2) ±200 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Supply voltage 2.7 5.5 V Temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) LMV341-N LMV342-N LMV344-N UNIT DCK (SC70) D (SOIC) DGK (VSSOP) D (SOIC) PW (TSSOP) 6 PINS 8 PINS 8 PINS 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 414 190 235 145 155 °C/W RθJC(top) Junction-to-case (top) thermal resistance 116.1 65.2 68.4 45.9 50.5 °C/W RθJB Junction-to-board thermal resistance 53.3 61.4 98.8 44.1 66.2 °C/W ψJT Junction-to-top characterization parameter 8.8 16.1 9.8 10.2 6.3 °C/W ψJB Junction-to-board characterization parameter 52.7 60.8 97.3 43.7 65.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — — °C/W |
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