6

TCA9555

SCPS200D – JULY 2009 – REVISED JULY 2016

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TCA9555

UNIT

PW

(TSSOP)

DB

(SSOP)

RTW

(WQFN)

RGE

(VQFN)

24 PINS

24 PINS

24 PINS

24 PINS

Junction-to-ambient thermal resistance

108.8

92.9

43.6

48.4

°C/W

Junction-to-case (top) thermal resistance

54

53.5

46.2

58.1

°C/W

Junction-to-board thermal resistance

62.8

50.4

22.1

27.1

°C/W

Junction-to-top characterization parameter

11.1

21.9

1.5

3.3

°C/W

Junction-to-board characterization parameter

62.3

50.1

22.2

27.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

10.7

15.3

°C/W

(1)

(2)

Each I/O must be externally limited to a maximum of 25 mA, and each octal (P07–P00 and P17–P10) must be limited to a maximum

current of 100 mA, for a device total of 200 mA.

(3)

The total current sourced by all I/Os must be limited to 160 mA (80 mA for P07–P00 and 80 mA for P17–P10).

7.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

Input diode clamp voltage

1.65 V to 5.5 V

–1.2

V

1.65 V to 5.5 V

1.2

1.5

V

1.65 V to 5.5 V

0.75

1

V

1.65 V

1.2

V

2.3 V

1.8

3 V

2.6

4.75 V

4.1

1.65 V

1

2.3 V

1.7

3 V

2.5

4.75 V

4

Low-level output current

SDA

1.65 V to 5.5 V

3

mA

1.65 V to 5.5 V

8

mA

1.65 V to 5.5 V

10

mA

INT

1.65 V to 5.5 V

3

mA

Input leakage current

SCL,

SDA

Input

leakage

1.65 V to 5.5 V

±1

μA

A2–A0

Input

leakage

1.65 V to 5.5 V

±1

μA

Input high leakage current

P port

1.65 V to 5.5 V

1

μA

Input low leakage current

P port

1.65 V to 5.5 V

–100

μA