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TCA9539-Q1 Datasheet(PDF) 31 Page - Texas Instruments

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Part # TCA9539-Q1
Description  Low Voltage 16-Bit I2C and SMBus Low-Power I/O Expander with Interrupt Output, Reset Pin, and Configuration Registers
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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TCA9539-Q1 Datasheet(HTML) 31 Page - Texas Instruments

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TCA9539
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SCPS202C – OCTOBER 2009 – REVISED MAY 2016
Product Folder Links: TCA9539
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Copyright © 2009–2016, Texas Instruments Incorporated
11 Layout
11.1 Layout Guidelines
For printed circuit board (PCB) layout of the TCA9539, common PCB layout practices must be followed but
additional concerns related to high-speed data transfer such as matched impedances and differential pairs are
not a concern for I2C signal speeds.
In all PCB layouts, it is a best practice to avoid right angles in signal traces, to fan out signal traces away from
each other upon leaving the vicinity of an integrated circuit (IC), and to use thicker trace widths to carry higher
amounts of current that commonly pass through power and ground traces. By-pass and de-coupling capacitors
are commonly used to control the voltage on the VCC pin, using a larger capacitor to provide additional power in
the event of a short power supply glitch and a smaller capacitor to filter out high-frequency ripple. These
capacitors must be placed as close to the TCA9539 as possible. These best practices are shown in Figure 43.
For the layout example provided in Figure 43, it would be possible to fabricate a PCB with only 2 layers by using
the top layer for signal routing and the bottom layer as a split plane for power (VCC) and ground (GND). However,
a 4 layer board is preferable for boards with higher density signal routing. On a 4 layer PCB, it is common to
route signals on the top and bottom layer, dedicate one internal layer to a ground plane, and dedicate the other
internal layer to a power plane. In a board layout using planes or split planes for power and ground, vias are
placed directly next to the surface mount component pad which must attach to VCC or GND and the via is
connected electrically to the internal layer or the other side of the board. Vias are also used when a signal trace
must be routed to the opposite side of the board, but this technique is not demonstrated in Figure 43.


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