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LMP8480ASQDGKRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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LMP8480ASQDGKRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 27 page 4 LMP8480-Q1, LMP8481-Q1 SNVSAL6 – JULY 2016 www.ti.com Product Folder Links: LMP8480-Q1 LMP8481-Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation PDMAX = (TJ(MAX) –TA)/ θJA or the number given in Absolute Maximum Ratings, whichever is lower. (2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (4) When the input voltage (VIN) at any pin exceeds power supplies (VIN < GND or VIN > VS ), the current at that pin must not exceed 5 mA, and the voltage (VIN) has to be within the Absolute Maximum Ratings for that pin. The 20-mA package input current rating limits the number of pins that can safely exceed the power supplies with current flow to four pins. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT Supply voltage (VCC to GND) –0.3 85 V RSP or RSN to GND –0.3 85 V VOUT to GND –0.3 to the lesser of (VCC + 0.3) or +20 V VREF pins (LMP8481-Q1 only) Other VREF pin tied to ground –0.3 12 V Applied to both VREF pins tied together –0.3 6 Differential input voltage –85 85 V Current into output pin –20(4) 20 mA Current into any other pins –5(4) 5 mA Operating temperature –40 125 °C Junction temperature -40 150 °C Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±750 (1) Exceeding the Recommended Operating Conditions for extended periods of time may effect device reliability or cause parametric shifts. 7.3 Recommended Operating Conditions Expected normal operating conditions over free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage (VCC) 4.5 76 V Common mode voltage 4.0 76 V Reference input (LMP8481-Q1 only) VREFA and VREFB tied together –0.3 to the lesser of (VCC – 1.5) or +6 V Single VREF pin with other VREF pin grounded –0.3 or +12 where the average of the two VREF pins is less than the lesser of (VCC – 1.5) or +6 V (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) LMP8480-Q1, LMP8481-Q1 UNIT DGK NCQ 8 PINS RθJA Junction-to-ambient thermal resistance 185 70 °C/W |
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