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LMK60E2-150M00

LMK60E2-156M25, LMK60E0-156257

SNAS687A – JUNE 2016 – REVISED AUGUST 2016

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Product Folder Links: LMK60E2-150M00 LMK60E2-156M25 LMK60E0-156257

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD

Device Supply Voltage

–0.3

3.6

V

Output Voltage Range for Logic Inputs

–0.3

VDD + 0.3

V

Output Voltage Range for Clock Outputs

–0.3

VDD + 0.3

V

Junction Temperature

150

°C

Storage Temperature

–40

125

°C

(1)

JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Device Supply Voltage

3.135

3.3

3.465

V

Ambient Temperature

–40

25

85

°C

Junction Temperature

120

°C

VDD Power-Up Ramp Time

0.1

100

ms

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The package thermal resistance is calculated on a 4 layer JEDEC board.

(3)

Connected to GND with 3 thermal vias (0.3-mm diameter).

(4)

ψJB (junction to board) is used when the main heat flow is from the junction to the GND pad. Please refer to Thermal Considerations

section for more information on ensuring good system reliability and quality.

6.4 Thermal Information

UNIT

QFM (SIA)

6 PINS

Airflow (LFM) 0

Airflow (LFM) 200

Airflow (LFM) 400

Junction-to-ambient thermal resistance

55.2

46.4

43.7

°C/W

34.6

n/a

n/a

Junction-to-board thermal resistance

37.7

n/a

n/a

Junction-to-top characterization parameter

11.3

17.6

22.5

Junction-to-board characterization parameter

37.7

41.5

40.1

n/a

n/a

n/a