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LMG3410

SNOSD10A – APRIL 2016 – REVISED JUNE 2016

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Copyright © 2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 4

6.5

Electrical Characteristics........................................... 5

6.6

Switching Characteristics .......................................... 6

6.7

Typical Characteristics .............................................. 7

7

Parameter Measurement Information .................. 9

7.1

Switching Parameters ............................................... 9

8

Detailed Description ............................................ 11

8.1

Overview ................................................................. 11

8.2

Functional Block Diagram ....................................... 11

8.3

Feature Description................................................. 12

8.4

Device Functional Modes........................................ 13

9

Application and Implementation ........................ 14

9.1

Application Information............................................ 14

9.2

Typical Application ................................................. 14

9.3

Do's and Don'ts ...................................................... 17

10

Power Supply Recommendations ..................... 18

10.1

Using an Isolated Power Supply ........................... 18

10.2

Using a Bootstrap Diode ...................................... 18

11

Layout................................................................... 20

11.1

Layout Guidelines ................................................. 20

11.2

Layout Example .................................................... 21

12

Device and Documentation Support ................. 23

12.1

Device Support...................................................... 23

12.2

Documentation Support ....................................... 23

12.3

Receiving Notification of Documentation Updates 23

12.4

Community Resources.......................................... 23

12.5

Trademarks ........................................................... 23

12.6

Electrostatic Discharge Caution ............................ 23

12.7

Glossary ................................................................ 23

13

Mechanical, Packaging, and Orderable

Information ........................................................... 23

13.1

Package Option Addendum .................................. 24

4 Revision History

Changes from Original (April 2016) to Revision A

Page

•

Clarified part features list on front page ................................................................................................................................ 1

•

Clarified first-page description to better describe functionality of device .............................................................................. 1

•

Changed Theta_JA number to JEDEC standard PCB .......................................................................................................... 4

•

Clarified definition of turn-on and turn-off energy ................................................................................................................ 10

•

Corrected wording in Do's and Don'ts section ..................................................................................................................... 17

•

Removed non-suitable isolated supply recommendation ..................................................................................................... 18

•

Added note on MSL 3 manufacturing guidance ................................................................................................................... 23