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5962-9560402QXA Datasheet(PDF) 3 Page - Texas Instruments |
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5962-9560402QXA Datasheet(HTML) 3 Page - Texas Instruments |
3 / 25 page LM6172QML www.ti.com SNOSAR4A – DECEMBER 2010 – REVISED OCTOBER 2011 ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage (V+ − V−) 36V Differential Input Voltage (2) ±10V Maximum Junction Temperature 150°C Power Dissipation (3), (4) 1.03W Output Short Circuit to Ground (5) Continuous Storage Temperature Range −65°C ≤ TA ≤ +150°C Common Mode Voltage Range V+ +0.3V to V− −0.3V Input Current ±10mA Thermal Resistance (6) θJA 8LD CDIP (Still Air) 100°C/W 8LD CDIP (500LF/Min Air Flow) 46°C/W 16LD CLGA (Still Air) “WG” 124°C/W 16LD CLGA (500LF/Min Air Flow) “WG” 74°C/W 16LD CLGA (Still Air) “GW” 135°C/W 16LD CLGA (500LF/Min Air Flow) “GW” 85°C/W θJC 8LD CDIP (4) 2°C/W 16LD CLGA “WG”(4) 6°C/W 16LD CLGA “GW” 7°C/W Package Weight 8LD CDIP 980mg 16LD CLGA “WG” 365mg 16LD CLGA “GW” 410mg ESD Tolerance (7) 4KV (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) Differential Input Voltage is measured at VS = ±15V. (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. (4) The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. (5) Continuous short circuit operation can result in exceeding the maximum allowed junction temperature of 150°C (6) All numbers apply for packages soldered directly into a PC board. (7) Human body model, 1.5 k Ω in series with 100 pF. RECOMMENDED OPERATING CONDITIONS (1) Supply Voltage 5.5V ≤ VS ≤ 36V Operating Temperature Range −55°C ≤ TA ≤ +125°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Copyright © 2010–2011, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM6172QML |
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