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SN74LVCH16652ADGVR Datasheet(PDF) 6 Page - Texas Instruments |
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SN74LVCH16652ADGVR Datasheet(HTML) 6 Page - Texas Instruments |
6 / 26 page SN74LVCH16652A SCAS319J – NOVEMBER 1993 – REVISED DECEMBER 2014 www.ti.com 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Operating 1.65 3.6 VCC Supply voltage V Data retention only 1.5 VCC = 1.65 V to 1.95 V 0.65 × VCC VIH High-level input voltage VCC = 2.3 V to 2.7 V 1.7 V VCC = 2.7 V to 3.6 V 2 VCC = 1.65 V to 1.95 V 0.35 × VCC VIL Low-level input voltage VCC = 2.3 V to 2.7 V 0.7 V VCC = 2.7 V to 3.6 V 0.8 VI Input voltage 0 5.5 V High or low state 0 VCC VO Output voltage V 3-state 0 5.5 VCC = 1.65 V –4 VCC = 2.3 V –8 IOH High-level output current mA VCC = 2.7 V –12 VCC = 3 V –24 VCC = 1.65 V 4 VCC = 2.3 V 8 IOL Low-level output current mA VCC = 2.7 V 12 VCC = 3 V 24 Δt/Δv Input transition rise or fall rate 10 ns/V TA Operating free-air temperature –40 125 °C (1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 7.4 Thermal Information SN74LVCH16652A THERMAL METRIC(1) DGG DGV DL UNIT 56 PINS RθJA Junction-to-ambient thermal resistance 60.6 72.8 53.1 RθJC(top) Junction-to-case (top) thermal resistance 17.9 27.5 18.3 RθJB Junction-to-board thermal resistance 29.4 38.3 25.8 °C/W ψJT Junction-to-top characterization parameter 0.8 1.7 1.4 ψJB Junction-to-board characterization parameter 29.1 37.8 25.6 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 1993–2014, Texas Instruments Incorporated Product Folder Links: SN74LVCH16652A |
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